A precision lead screw for high-performance semiconductor chip wedge bonders,comprising a lead screw body,a nut meshed with the surface of the lead screw body,and protective covers fixedly connected to both left and right ends of the lead screw body.The protective covers are sleeved over the surface of the lead screw body and fixedly connected to connection rings.The inner side of each connection ring contacts the surface of the nut.Claws are pivotally connected via pins to both top and bottom sides of the nut extending outward beyond the connection rings and contacting their surfaces.

By incorporating retractable protective covers on the lead screw body,external dust is effectively blocked,preventing dust from compromising the operational precision of the lead screw.This design resolves issues in existing wedge bonder lead screws,such as inadequate protection,susceptibility to dust-induced performance degradation,and reduced semiconductor chip processing yield.This series of lead screw assemblies has been granted a utility model patent.

Vertical and X-Axis Sliding Lead Screw & Anti-Backlash Nut Models

9.525×12.7(4-start thread)ACME lead screw assembly

12.7×12.7(4-start thread)ACME lead screw assembly

12.7×2.54(single-start thread)ACME lead screw assembly

Lead Screw Performance Parameters and Advantages

Lead accuracy:0.05mm/200mm

Transmission efficiency: >58%

Novel dry-film lubrication technology,surpassing domestic imitation stages

Durability upgraded from 100,000 to 1,000,000 cycles

Advanced functional surface dry-film lubrication delivers:High precision,low noise lubrication-free operation,wear resistance,dustproofing,electrical insulation,water resistance,anti-adhesion.